Fresh details on Qualcomm’s next-generation Snapdragon X2 desktop CPUs have been revealed, and they include a dramatic increase in processing power as well as an out-of-the-box design strategy. As reported by WinFuture, the Snapdragon X2 series will have a maximum of 18 “Oryon V3” cores, which will be a significant jump from Qualcomm’s current Snapdragon X Elite lineup.
Going for a Larger PC Market Share
After an inaugural success in the laptop space, Qualcomm is looking to step up its desktop drive under its “Project Glypur” project. The growth of CPU core numbers implies a stronger and more efficient design, and hints at Qualcomm’s intent to challenge legacy x86-based desktop processors.
Is This a Game-Changing SiP Design?
Perhaps the most interesting feature of the Snapdragon X2 CPUs is the expected System-in-Package (SiP) design, which allegedly includes both memory and SSD storage inside the CPU package itself.
As of yet, information on how this technology will work is still limited, but such an innovation could result in quicker data access speeds, lower power usage, and better system efficiency.
What This Means for the Future of Qualcomm CPUs
With 18-core architecture and innovative SiP implementation, Qualcomm is escalating the game in the desktop CPU space. If the Snapdragon X2 series pans out as expected, it can usher in a new generation of high-performance ARM-based computing, further disrupting Intel and AMD both in laptops and desktops.